Nanowave Technologies works with a wide variety of process technologies to provide the best combination of performance and cost to meet the needs of our customers. Many solutions contain semiconductor devices designed by Nanowave and manufactured to specification at device foundries around the world. Nanowave solutions almost exclusively incorporate die-based hybrid solutions to maximize performance, minimize size, and manage inventory for long term programs. Choosing the best combination of process and device design allows Nanowave to deliver the best cost/performance for the frequency range and power level needed. These die may be single devices or MMIC (Monolithic Microwave Integrated Circuits) depending on application needs. The die are integrated into packages using our Thin Film and MHMIC technologies for final product realization.
Examples of process technologies employed by Nanowave
- Gallium Nitride (GaN)
- Gallium Arsenide (GaAs)
- Silicon Germanium (SiGe)
- Indium Phosphide (InP)
- Laterally Diffused Metal Oxide Semiconductor (LDMOS)