Automated Hybrid Assembly
Bare die integration for highest performance
Nanowave Technologies has advanced components and subsystems manufacturing technology utilizing automated assembly of hybrid microwave circuits. The result is superbly consistent quality and performance at high volume and at lower cost using our internally fabricated thin film circuits.
Bare die are attached using precision pick and place robotics with eutectic soldering, on pre-deposited AuSn, or AuSn solder preforms. Similarly other chip components are attached with qualified epoxies by automated dispensing and placement equipment. High precision automated wire bonding completes the assembly with consistent wire bond length and loop shapes essential for high frequency RF functions.