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Core Technologies
 


Three essential Core Technologies are the colums of Nanowave's vertically integrated business model:

Thin Film

MHMIC

Assembly / Packaging


Nanowave's thin film manu-facturing is performed in class 1,000-100,000 clean rooms. Equipment includes:

high volume 3- and 4-target
  sputtering systems,

e-beam eva-poration systems,
ion-beam milling,
precision electroplating of gold,
  copper, and nickel,

manual and cassette-to-cassette
  mask aligners

PECVD dielectric deposition system,
precision wafer saws for dicing.

Substrates from 1" x 1" to 4" x 4" or 100mm diameter wafers can be handled.


Nanowave's specialized thin film technology is the
Miniature Hybrid Microwave Integrated Circuits (MHMICs) .

Fully integrated passive microwave circuitry includes:
metallized vias
overlay capacitors cycle
thin film resistors
spiral inductors
airbridges
multi-layer connectivity at
  RF frequencies.

Offers lower cost and lower loss performance than MMIC or HMIC technologies.

Quick turnaround and lower design costs than MMICs.


Microwave Module Assembly
Pick & place die attach
Thermo compression/thermosonic
   wedge bonding
Ultrasonic ball bonding and ribbon
   bonding
void-free vacuum eutectic die and
   substrate attachments
Component soldering
YAG laser welding, gap welding
Hermetic sealing of packages
Custom packages
Kovar, CuW, Silvar, Cu-Mo carriers
High power dissipation assemblies
RF acceptance testing to 65 GHz
Reliability tests
DC and logic testing, and transient
   response tests with nanosecond
   resolution
Automated equipment


Contact us for more information at info@nanowavetech.com!

 

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 last update: Nov 2, 2008 Copyright (C) 2008 Nanowave Technologies Inc.