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Nanowave Technologie offers a variety of Thin Film products, which are used in our own RF Systems and Subsystems. The reliabilty and quality is proven by numerous applications in Defense and Avionics where our Thin Film Technology is the platform for microwave and millimeterwave circuits.
Our focus is low to medium volumn specialized applications, such as thermal managment, high current, and low RF loss.
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Thick Copper Technology
Used for high-current, low-loss applications, offer very effective heat dissipation. Available on both, Alumina and AlN, with and without solder mask (green layer in right picture).
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substrate material:
critical dimension:
thickness Cu:
cap layer:
solder mask:
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Al2O3 or AlN
75 µm (lines and spacej s)
50 µm
Ni / Au (bondable)
available
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Standard Alumina Substrates (AlO)
Offers excellent RF features for frequencies up to 100 GHz, very low loss material, excellent bonding capability, plated vias
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Substrate material:
critical dimension:
metals:
layer thickness:
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Al2O3 (Aluminum Oxide)
25 µm (lines), 12 µm (spaces)
Ni / Au
3 - 5 µm
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Aluminum Nitride Substrates (AlN)
Low RF loss and high heat dissipation, very good through heat conductivity, for mounting on heat spreader, excellent RF behaviour
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Substrate material:
critical dimension:
metals:
layer thickness: |
AlN (Aluminum Nitride)
25 µm (lines), 12 µm (spaces)
Ni / Au
3 - 5 µm |
Miniature Hybrid Microwave Integraded Circuits (MHMICs)
Nanowave offers a MIL qualified Thin Film process, in which the following passive components are directly deposited onto the ceramic substrates
• inductors
• airbridges (supported or unsupported)
• MIM overlay capacitors
• interdigital capacitors
• thin fim resistors
• through / filled via holes
For additional information, please visit our Core Technologies page.
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Please contact sales@nanowavetech.com for further information!
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